Mrs-t260 is a fully automatic scribing machine, using double spindle design processing efficiency is higher. The whole function is divided by color, adhering to the user-centered design, the rotating screen is convenient to operate, the transparent glass is more intuitive to observe, and the efficient and humanized UI interface is designed. Using image recognition, knife mark detection and other technologies, can process the world's mainstream 8-12 inch wafers. Widely used in wafer, ceramics, silicon wafer, glass, PCB, lithium niobate, alumina, quartz and other semiconductor products processing.

More than 40 people participated in the project, responsible for: project leader, product manager, hardware design, electrical design, software design, industrial design, experiment and test, quality control, supply chain guarantee, the company's internal staff completed the design, development and test of the project; At the same time, external experts are invited to give professional opinions and suggestions in the project design and testing